CALL FOR EXPERIMENTS & DEMONSTRATIONS PROPOSALS
EMC and SI/Power Integrity hardware experiments and demonstrations continue to be a very popular symposium event, and the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity will be no exception. The event’s purpose is to demonstrate important, fundamental EMC and SIPI topics and contemporary areas of interest through practical experiments and demonstrations that may be based on hardware configurations, software programming, or a combination of both.
Experiments new to the symposium venue are encouraged each year and oft-times popular demonstrations from previous years are reprised. Original presentations are highly desirable. Hands-on participation for attendees during experiments and demonstrations is also encouraged.
Presentations may be based upon those documented in the EdCom’s EMC Experiments Manual, originally compiled by Clayton Paul and Henry Ott. Past experiments have demonstrated the effects of PC board radiation coupling; component-cable crosstalk; grounding and shielding strategies; spectral analysis techniques using test hardware; effective EMC and Signal and Power Integrity test methods and practices; use of EMC instrumentation to measure interference at the device or component level, and the role of EMC standards as part of overall measurement practices.
Proposals should include a description of the demonstration to be performed with sufficient detail to convey a technical understanding to the chairs of the EMC or SIPI topic to be demonstrated. Test equipment and audio-visual support are available to all presenters. Please include a listing of necessary/desired support test and A/V equipment in proposal submittals.
A partial list of potential hardware topics includes:
- Application of magnetic pickup loops and current probes
- Transmission-line effects on PCBs
- Coupling and multi-conductor transmission lines
- Use of ferrites for EMI control
- Measurement versus calculation of signal spectra
- Minimizing magnetic field susceptibility
- Measurement and control of EMI in spread spectrum systems Measurement of common versus differential mode coupling
- Proper application of LISNs
- Electrostatic discharge phenomena
- Effects of clock frequencies
- Mode stirring
- Electromagnetic leakage through seams and joints
- Ground” bounce
- Electromagnetic product safety
- Signal integrity issues for PCBs
A partial list of potential computer modeling topics includes:
- Shielding Effectiveness Simulation Using the FDTD Method
- Modeling the Shielding Effectiveness Using Integral Equation Techniques
- Radiation Through Apertures, Gaskets and Joints
- Large Complex System Analysis Using MLFMA
- System-Level EMC Antenna Coupling Analysis for Large, Complex Structure Topologies Using Multi-Fidelity Modeling and Simulation Methods
- Modeling of Simultaneous Switching Noise in High Speed Systems
- Power Bus Resonance and Associated EMI Simulations for PCBs
- EMC Simulation Techniques for Printed Circuit Boards
- Power and Ground Voltage Fluctuations and Effects of Decoupling Capacitors on PCBs
- FDTD Modeling of DC Power-Busses
- Emission Environment Modeling and Analysis
- FEM Analysis of Printed Circuit Board Signal Coupling
- Model Validation for Electromagnetic Codes
- Printed Circuit Board Edge Effects
- Visualization of Fields in Radiated Test Sites
- Characterization of Test Cells and Measurement Enclosures, Including the Simulation of EMC Chambers Behavior at Low Frequencies
- Complex Coupling Phenomena
- DC Power Bus Modeling Using the PEEC Method.
Schedule for Proposals for Experiments and Demonstrations:
- Proposals are accepted between October 1, 2018 and March 15, 2019.
- Final notice of acceptance March 23, 2019.
The template file for presenters can be found here. The screen size is 16:9 widescreen.
Please send your submissions to:
Experiments and Demonstrations Co-Chairs: