EMC FUNDAMENTALS

EMC FUNDAMENTALS

Co-Chairs:
Frank Leferink, Thales Nederland B.V., Hengelo, and University of Twente, Enschede, the Netherlands
John McCloskey, NASA Goddard Space Flight Center (GSFC), Greenbelt, MD, USA

This tutorial is an overview of many of the major topics that need to be considered when designing an electronic product or system to meet signal and power integrity (SIPI) and electromagnetic compatibility (EMC) requirements. The tutorial will present the foundational ideas from physics and mathematics and will demonstrate the engineering approaches to help the attendees to successfully design, evaluate, diagnose, and/or solve EMI problems. The main objective of this tutorial is to provide a learning opportunity for those that are new to EMC as well as provide a review of the basics to those who already have some experience in this area.

 

PLANNED SPEAKERS & TOPICS

8:30 AM - 12:00 PM

Introduction

John McCloskey, NASA Goddard Space Flight Center (GSFC), Greenbelt, MD, USA
Welcome and Presentation. Why a Fundamentals Session for EMC? Tutorial Outline and Speakers Overview.


Inductance

Bruce Archambeault, Missouri University of Science and Technology, Rolla, MO, USA and IBM, Research Triangle Park, NC, USA
Relationship between voltage, E-fields and capacitance. Relationship between currents, H-fields and inductance. Definition of inductance from Faraday’s law, loop inductance (highlight loop size and current density as secondary but important in some cases), how to calculate, mutual inductance (effect of distance between loops). Definition and concepts of internal and external inductance, self and mutual inductance, partial inductance. Estimating inductance of canonical structures.


Crosstalk

Eric Bogatin, Teledyne LeCroy, Univ. of Colorado Boulder, Longmont, CO, USA
The physical and mathematical basis behind crosstalk (E-field and H-field); identifying inductive/capacitive/common- impedance coupling mechanisms; mitigation techniques, including shielding. PCB and cables/connectors.

 

Transmission Lines and Basic Signal Integrity

Xaioning Ye, Intel Corporation, Hillsboro, OR, USA
Typical SI issues and mitigation for interconnect including: loss, Impedance mismatch, Crosstalk, etc. Impact of transmission line behavior on signal integrity; non-ideal interconnect. very basic channel analysis (jitter, eye diagrams, equalization, etc.)

 

PCB Decoupling

Jim Drewniak and Chulsoon Hwang, Missouri University of Science and Technology, Rolla, MO, USA
The impact of parasitics on the performance of decoupling capacitors; placement of decoupling capacitors depending on the board stack-up and the required frequency of performance; decoupling for EMI compared to SI; embedded capacitance.
Time domain analysis vs. steady state frequency domain analysis.

 

1:30 PM - 5:00 PM


Grounding

Todd Hubing, LearnEMC, Stoughton, WI, USA
The importance of proper grounding. How to ground for emissions and immunity vs. grounding for safety.  Relationship between grounding and bonding. Single-point grounds, ground loops, and the difference between “ground” and “current return.” The influence of frequency and inductance on return currents; the impact of the return path on emissions and susceptibility. Return current spread (microstrip vs. stripline), effect of via transitions on return current. Current paths in buildings, vehicles and enclosures; as well as current paths at the PCB-level and IC-level.


Filtering

Frank Leferink, Thales Nederland B.V., Hengelo, and University of Twente, Enschede, the Netherlands
Parasitic effects in real world filter components. Differential and common-mode signals; imbalance in differential-mode circuits, the concept of noise blocking and noise diversion; common filter configurations; filtering of common-mode and differential mode noise; implementation of filters for power lines and for I/O; measurement of conducted noise.


Shielding

Pablo Narvaez, NASA Jet Propulsion Laboratory, Pasadena, CA, USA
A brief introduction to the theory of shielding; absorption and reflection loss, the difference between electric, low-frequency magnetic and high-frequency magnetic field shielding. Near field shielding vs. shielding to reduce far field radiation. Shielded enclosures and the influence of apertures and holes on shielding effectiveness. Shielding materials and gaskets; effective and ineffective techniques of implementing a shield. Discussion of cable shielding.


Conducted Emissions

Lee Hill, Silent Solutions LLC & GmbH, Worcester Polytechnic Institute (WPI), Amherst, NH, USA
A description of and the physics involved in conducted emissions. Overview of conducted emissions regulations. Understanding the purpose and use of a “Line Impedance Stabilization Network” (LISN). Characteristics of “intentional” differential mode current and causes of common mode current. Basic filters and methods used to suppress either differential or common mode current to meet requirements.


Radiated Emissions

Cheung-Wei Lam, Apple Inc., Cupertino, CA USA
Frequency content of digital signals; generation of electric and magnetic fields; identifying typical noise sources that drive unintentional antennas; source suppression techniques; efficiency of unintentional antenna vs. physical/electric size; typical coupling paths and mitigation options; troubleshooting radiated emission problems.


Wrap up

Frank Leferink, Thales Nederland B.V., Hengelo, and University of Twente, Enschede, the Netherlands

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